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Underfills
LOCTITE 3128 10ml
LOCTITE 3128, Epoxy, One component
Availability: on order
Dispatched within: 2 months
LOCTITE 3508NH 30ml
Cornerfill
LOCTITE 3508NH, Epoxy, Underfill
Availability: discontinued
€151.21
Net price: €122.94
LOCTITE 3513 30ML MOQ 10 sztuk
LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
Availability: on order
Dispatched within: 3 months
LOCTITE 3536 30ML EFD EN/CH
One-component | Reworkable | Cures rapidly at low temperatures
Availability: medium quantity
Dispatched within: 24h
LOCTITE ECCOBOND 3593, 30CC
LOCTITE 3593 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for chip size
packages.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 1173 15gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: medium quantity
Dispatched within: 24h
LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 55cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECCOBOND UF 3811 5cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 40 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
Solvent for uncured epoxies Loctite SF 7360 500ml
Aliphatic ester clear solvent cleaner for removing uncured adhesive and adhesive residue from PCBs. Fully compatible with epoxy adhesives.
Availability: medium quantity
Dispatched within: 24h
Underfill LOCTITE ECCOBOND E 1216M, 55cc
Availability: on order
Dispatched within: 2 months
Underfill LOCTITE ECCOBOND FP4531 5ml
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
Availability: on order
Dispatched within: 1 month
Underfill LOCTITE ECCOBOND UF 1173 80gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: on order
Dispatched within: 2 months
