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€13.65
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€15.17
€11.10
Regular price:
€12.33
€18.87
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€20.96
€15.34
Regular price:
€17.04
€42.47
Regular price:
€47.18
€34.53
Regular price:
€38.36
€10.74
Regular price:
€11.93
€8.73
Regular price:
€9.70
€16.37
Regular price:
€18.18
€13.31
Regular price:
€14.78
€18.66
Regular price:
€20.73
€15.17
Regular price:
€16.85
€14.38
Regular price:
€15.98
€11.70
Regular price:
€12.99
€18.66
Regular price:
€20.73
€15.17
Regular price:
€16.85
€39.61
Regular price:
€44.01
€32.20
Regular price:
€35.78
€42.74
Regular price:
€47.49
€34.75
Regular price:
€38.61
€19.39
Regular price:
€21.54
€15.76
Regular price:
€17.51
€23.77
Regular price:
€26.41
€19.32
Regular price:
€21.47
€13.09
€10.64
€33.59
€27.31
€12.05
€9.79
€17.03
€13.84
€77.60
€63.09
€57.80
€46.99
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18-25*C
2-8*C
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Underfills
LOCTITE 3508NH 30ml
Cornerfill
LOCTITE 3508NH, Epoxy, Underfill
Availability: discontinued
€151.21
Net price: €122.93
LOCTITE 3513 30ML MOQ 10 sztuk
LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
Availability: temporarily unavailable
LOCTITE 3536 30ML EFD EN/CH
One-component | Reworkable | Cures rapidly at low temperatures
Availability: medium quantity
Dispatched within: 24h
LOCTITE ECCOBOND 3593, 30CC
LOCTITE 3593 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for chip size
packages.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 1173 15gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 55cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECCOBOND UF 3811 5cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 40 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
Solvent for uncured epoxies Loctite SF 7360 500ml
Aliphatic ester clear solvent cleaner for removing uncured adhesive and adhesive residue from PCBs. Fully compatible with epoxy adhesives.
Availability: last pieces
Dispatched within: 24h
Underfill LOCTITE ECCOBOND E 1216M, 55cc
Availability: on order
Dispatched within: 2 months
Underfill LOCTITE ECCOBOND FP4531 5ml
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
Availability: on order
Dispatched within: 3 months
Underfill LOCTITE ECCOBOND UF 1173 80gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: on order
Dispatched within: 2 months
