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Underfills
LOCTITE 3513 30ML MOQ 10 sztuk
LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
Availability: on order
Dispatched within: 3 months
LOCTITE 3536 30ML EFD EN/CH
One-component | Reworkable | Cures rapidly at low temperatures
Availability: last pieces
Dispatched within: 24h
LOCTITE ECCOBOND 3593, 30CC
LOCTITE 3593 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for chip size
packages.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 55cc - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 5cc - MOQ 40 pcs
LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant
Availability: on order
Dispatched within: 2 months
Loctite SF 7360 500ml
Aliphatic ester clear solvent cleaner for removing uncured adhesive and adhesive residue from PCBs. Fully compatible with epoxy adhesives.
Availability: medium quantity
Dispatched within: 24h
