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» Underfill LOCTITE ECCOBOND UF 1173 80gr

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Underfill LOCTITE ECCOBOND UF 1173 80gr

packshot-grp-loctite-eccobond-uf-1173-117998-01-2020.png

Availability: on order

Dispatched within: 2 months

Delivery: The price does not include any possible payment costs check the delivery methods

Gross price: €444.51

incl. 23% TAX, excl. shipping costs

444.51

Net price: €361.39

excl. 23% TAX, excl. shipping costs

quantity pc.

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Product code: 2420246

Description

LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.

Single component
Void free underfill
Long pot life
Low CTE