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Underfill LOCTITE ECCOBOND UF 1173 80gr

Availability: on order
Dispatched within: 2 months
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €452.77
incl. 23% TAX, excl. shipping costs
452.77
Net price: €368.11
excl. 23% TAX, excl. shipping costs
quantity pc.

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Description

LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.
  • Single component
  • Void free underfill
  • Long pot life
  • Low CTE
Files to download:

Files to download

LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.
  • Single component
  • Void free underfill
  • Long pot life
  • Low CTE
Files to download:

Technical data

18-25*C No
2-8*C No
0*C No
-20*C No
-40*C Yes

Shipping costs The price does not include any possible payment costs

Shipping country:

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