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LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
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Description
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
- Fast cure at moderate temperatures
- Halogen free
- High Tg
- Compatible with most Pb-free solders
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Files to download
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
- Fast cure at moderate temperatures
- Halogen free
- High Tg
- Compatible with most Pb-free solders
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