€13.29
€10.81
€32.94
€26.78
€12.24
€9.95
€17.29
€14.06
€78.82
€64.08
€49.13
Regular price:
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€39.94
Regular price:
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LOCTITE ABLESTIK 286 50cc (blue) – epoxy adhesive for electronics assembly
LOCTITE ABLESTIK 286 Blue is a one-component epoxy adhesive designed for electronic assembly and industrial bonding applications. It provides strong mechanical performance, good thermal stability and reliable electrical insulation.
The blue color enables easy visual inspection during manufacturing.
Availability: last pieces
Dispatched within: 24h
NanoFlowX V2 – electronic waterproof nanocoating (IP67/IP68 protection) 1L w/UV
NanoFlowX V2 is an ultra-thin nanotechnology coating designed to protect electronic devices from water, humidity, corrosion and environmental contaminants. The coating forms an invisible protective layer approximately 300–500 nm thick that safeguards components without affecting electrical performance.
The solution delivers IP67/IP68 waterproof protection, requires no masking during application and is safe for connectors. Its fast dip-and-heat curing process makes NanoFlowX V2 a modern alternative to traditional conformal coatings used in electronics manufacturing.
Availability: on order
Dispatched within: 2 weeks
LOCTITE ABLESTIK 45 W1-CAT15 50ml
LOCTITE ABLESTIK 45 W1 with CAT 15 hardener is a two-component epoxy adhesive designed for general assembly and structural bonding applications. The adhesive provides high mechanical strength, excellent shock and peel resistance, and strong adhesion to metals, glass, ceramics and many plastics.
The adjustable mix ratio allows rigid, semi-rigid or flexible cured formulations depending on application requirements. The product is supplied in a 50 ml dual cartridge, enabling convenient dispensing and mixing.
Availability: on order
Dispatched within: 2 months
Epoxy resin LOCTITE STYCAST E 2534 FR 5kg - flame-retardant
LOCTITE STYCAST E-2534 FR is a two-component epoxy encapsulation compound designed for potting and protecting electronic components. It offers excellent electrical insulation, high mechanical strength, and flame-retardant properties, making it suitable for applications requiring enhanced fire safety.
Availability: on order
Dispatched within: 1 month
LOCTITE STYCAST 2651 W1 25kg
LOCTITE 3621, Epoxy, Surface mount adhesive
Availability: on order
Dispatched within: 1 month
LOCTITE STYCAST 2651 W1 5kg
LOCTITE 3621, Epoxy, Surface mount adhesive
Availability: on order
Dispatched within: 1 month
LOCTITE STYCAST 2651-40 W1 25kg
LOCTITE STYCAST 2651-40 W1 is a two-component epoxy encapsulation compound designed for potting and protecting electronic components. It provides excellent electrical insulation, high mechanical strength, and reliable protection in demanding industrial environments.
Availability: on order
Dispatched within: 1 month
LOCTITE STYCAST 2651-40 W1 5kg
LOCTITE STYCAST 2651-40 W1 is a two-component epoxy encapsulation compound designed for potting and protecting electronic components. It provides excellent electrical insulation, high mechanical strength, and reliable protection in demanding industrial environments.
Availability: on order
Dispatched within: 1 month
LOCTITE ABLESTIK 50126FC 50cc
ABLESTIK 50126 FC is an accelerated version of ABLESTIK 50126.
Availability: on order
Dispatched within: 4 months
Silver ink LOCTITE ECI 1501 E&C 0,2kg - thermoformable
Made for one-time elongation during thermoformable process
Availability: on order
Dispatched within: 1 month
Silver ink LOCTITE ECI 1011 E&C 0,2kg - highest conductivity
LOCTITE ECI 1011 – High-Conductivity Silver Ink for Screen, Flexographic, and Gravure Printing. Intermetallic efect @ 150*C
Availability: on order
Dispatched within: 2 months
LOCTITE EDAG 1415M E&C 1,5kg silver shielding EMI/ESD
LOCTITE EDAG 1415M E&C is a silver-based conductive shielding coating designed to provide electromagnetic compatibility (EMC) in electronic device enclosures. It offers extremely low surface resistance, excellent EMI shielding performance, and can be easily applied by spray or brush.
Availability: on order
Dispatched within: 1 month
BERGQUIST HI FLOW THF 1600P 0.005" 0,127mm 12x10."
BERGQUIST HI FLOW THF 1600P is an electrically insulating, thermally conductive, and polyimide reinforced adhesive with excellent voltage breakdown and thermal performance.
Known as: Hi-Flow® 300P
Availability: medium quantity
Dispatched within: 24h
BERGQUIST GAP PAD TGP HC3000 0.04" 4x4"
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
Soft, fibreglass reinforced insulation pad - low stress applications
Known as: Gap Pad® HC 3.0
Availability: medium quantity
Dispatched within: 24h
Zinc and Silicone-Free Thermal Paste 10ml 1,5W/mK
Zinc and Silicone-Free Thermal Paste 779.010.NGZ15NF is a thermally conductive interface material designed to improve heat transfer between electronic components and heat sinks. Its silicone-free and zinc-oxide-free formulation provides stable performance, excellent wettability and low thermal resistance.
Ideal for electronic assemblies requiring reliable thermal management.
Availability: stock
Dispatched within: 24h


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