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Capillary fows, Reworkable
LOCTITE 3513 30ML MOQ 10 sztuk
LOCTITE® 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA.
Availability: temporarily unavailable
LOCTITE 3536 30ML EFD EN/CH
One-component | Reworkable | Cures rapidly at low temperatures
Availability: medium quantity
Dispatched within: 24h
LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 55cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECCOBOND UF 3811 5cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 40 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
