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LOCTITE ECCOBOND UF 3811 55cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
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Description
LOCTITE ECCOBOND UF 3811 is a high-performance, one-component epoxy underfill formulated for chip-scale package (CSP) and ball grid array (BGA) assemblies. This material flows at room temperature, requiring no preheat, and cures rapidly at moderate temperatures, reducing stress on delicate solder joints and nearby components.
Once cured, it delivers high mechanical strength and flexibility to absorb thermal and mechanical stresses during cycling and drop testing. It is halogen-free, reworkable, has stable electrical performance (SIR ≥10¹⁰ Ω), and meets NASA outgassing requirements – making it ideal for demanding electronic packaging environments.
Applications:
-
Underfill for CSP and BGA
-
Component encapsulation
-
Assemblies subject to thermal cycling and mechanical shock
-
Surface-mount technology in compact designs
Key Properties:
-
Technology: Heat-cure epoxy
-
Appearance: Black liquid
-
Viscosity: 354 mPa·s (25°C, 20 rpm)
-
Specific gravity: 1.16
-
Pot life @ 25°C: 3 days
-
Shelf life: 12 months (-20°C)
-
Cure schedule:
-
60 min @ 100°C
-
30 min @ 110°C
-
10 min @ 130°C
-
7 min @ 150°C
-
-
Tg (Glass Transition Temperature): 124°C
-
Storage modulus @ 25°C: 2,445 MPa
-
CTE:
-
Below Tg: 61 ppm/°C
-
Above Tg: 190 ppm/°C
-
-
Thermal conductivity: 0.23 W/m·K
-
Surface insulation resistance: ≥10¹⁰ Ω (168h, 60°C/90% RH)
-
NASA outgassing:
-
TML: 0.45%
-
CVCM: 0.04%
-
WVR: 0.31%
-
Files to download:
Files to download
LOCTITE ECCOBOND UF 3811 is a high-performance, one-component epoxy underfill formulated for chip-scale package (CSP) and ball grid array (BGA) assemblies. This material flows at room temperature, requiring no preheat, and cures rapidly at moderate temperatures, reducing stress on delicate solder joints and nearby components.
Once cured, it delivers high mechanical strength and flexibility to absorb thermal and mechanical stresses during cycling and drop testing. It is halogen-free, reworkable, has stable electrical performance (SIR ≥10¹⁰ Ω), and meets NASA outgassing requirements – making it ideal for demanding electronic packaging environments.
Applications:
-
Underfill for CSP and BGA
-
Component encapsulation
-
Assemblies subject to thermal cycling and mechanical shock
-
Surface-mount technology in compact designs
Key Properties:
-
Technology: Heat-cure epoxy
-
Appearance: Black liquid
-
Viscosity: 354 mPa·s (25°C, 20 rpm)
-
Specific gravity: 1.16
-
Pot life @ 25°C: 3 days
-
Shelf life: 12 months (-20°C)
-
Cure schedule:
-
60 min @ 100°C
-
30 min @ 110°C
-
10 min @ 130°C
-
7 min @ 150°C
-
-
Tg (Glass Transition Temperature): 124°C
-
Storage modulus @ 25°C: 2,445 MPa
-
CTE:
-
Below Tg: 61 ppm/°C
-
Above Tg: 190 ppm/°C
-
-
Thermal conductivity: 0.23 W/m·K
-
Surface insulation resistance: ≥10¹⁰ Ω (168h, 60°C/90% RH)
-
NASA outgassing:
-
TML: 0.45%
-
CVCM: 0.04%
-
WVR: 0.31%
-
Files to download:
Technical data
| Minimum order quantity | 10 |
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