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BERGQUIST GAP FILLER TGF 3600 50cc
ERGQUIST GAP FILLER TGF 3600 is a soft silicone-based thermal interface material designed to efficiently dissipate heat from electronic components. With a thermal conductivity of 3.6 W/m·K, it effectively fills air gaps between heat-generating components and heat sinks, improving thermal performance.
The material offers low thermal resistance, good electrical insulation and excellent conformability.
Known as BERGQUIST GAP FILLER 3500S35
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5
Safety
Description
BERGQUIST GAP FILLER TGF 3600 is a high-performance silicone-based thermal interface material designed to improve heat transfer between electronic components and heat sinks or enclosures. It belongs to the category of gap fillers, materials specifically engineered to eliminate air gaps that reduce thermal efficiency.
Its soft and compliant structure allows excellent surface wetting, minimizing thermal resistance and enhancing overall thermal management performance.
Key features
-
thermal conductivity: 3.6 W/m·K
-
excellent conformability
-
low thermal resistance
-
good electrical insulation
-
silicone-based for stability and durability
-
easy application
-
stress-relieving properties between components
Typical applications
BERGQUIST GAP FILLER TGF 3600 is used in:
-
power electronics modules
-
LED systems
-
automotive electronics
-
telecommunications equipment
-
industrial electronics
-
CPU/GPU cooling systems
Technical data
| Parameter | Value |
|---|---|
| Technology | silicone gap filler |
| Thermal conductivity | 3.6 W/m·K |
| Hardness | ~60 Shore 00 |
| Density | ~3.2 g/cm³ |
| Operating temperature | -60 to 200 °C |
| Dielectric strength | ~6 kV/mm |
| Dielectric constant | ~5.5 |
| Colour | grey |
5. FAQ
What is BERGQUIST GAP FILLER TGF 3600 used for?
It is used to transfer heat between electronic components and heat sinks by filling air gaps.
What is the thermal conductivity of TGF 3600?
The thermal conductivity is approximately 3.6 W/m·K.
Is BERGQUIST GAP FILLER TGF 3600 electrically insulating?
Yes, it provides good dielectric insulation while maintaining thermal conductivity.
Where is TGF 3600 typically used?
It is commonly used in power electronics, LED systems, automotive electronics and industrial devices.
Files to download:
Files to download
BERGQUIST GAP FILLER TGF 3600 is a high-performance silicone-based thermal interface material designed to improve heat transfer between electronic components and heat sinks or enclosures. It belongs to the category of gap fillers, materials specifically engineered to eliminate air gaps that reduce thermal efficiency.
Its soft and compliant structure allows excellent surface wetting, minimizing thermal resistance and enhancing overall thermal management performance.
Key features
-
thermal conductivity: 3.6 W/m·K
-
excellent conformability
-
low thermal resistance
-
good electrical insulation
-
silicone-based for stability and durability
-
easy application
-
stress-relieving properties between components
Typical applications
BERGQUIST GAP FILLER TGF 3600 is used in:
-
power electronics modules
-
LED systems
-
automotive electronics
-
telecommunications equipment
-
industrial electronics
-
CPU/GPU cooling systems
Technical data
| Parameter | Value |
|---|---|
| Technology | silicone gap filler |
| Thermal conductivity | 3.6 W/m·K |
| Hardness | ~60 Shore 00 |
| Density | ~3.2 g/cm³ |
| Operating temperature | -60 to 200 °C |
| Dielectric strength | ~6 kV/mm |
| Dielectric constant | ~5.5 |
| Colour | grey |
5. FAQ
What is BERGQUIST GAP FILLER TGF 3600 used for?
It is used to transfer heat between electronic components and heat sinks by filling air gaps.
What is the thermal conductivity of TGF 3600?
The thermal conductivity is approximately 3.6 W/m·K.
Is BERGQUIST GAP FILLER TGF 3600 electrically insulating?
Yes, it provides good dielectric insulation while maintaining thermal conductivity.
Where is TGF 3600 typically used?
It is commonly used in power electronics, LED systems, automotive electronics and industrial devices.
Files to download:
Shipping costs
The price does not include any possible payment costs
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