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BERGQUIST GAP FILLER TGF 3600 50cc
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BERGQUIST GAP FILLER TGF 3600 50cc
BERGQUIST GAP FILLER TGF 3600 50cc

€49.13

Regular price: €57.80

Lowest price: €58.82

€39.94

Regular price: €46.99

Lowest price: €47.82
pc.
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BERGQUIST GAP FILLER TGF 3600 50cc

ERGQUIST GAP FILLER TGF 3600 is a soft silicone-based thermal interface material designed to efficiently dissipate heat from electronic components. With a thermal conductivity of 3.6 W/m·K, it effectively fills air gaps between heat-generating components and heat sinks, improving thermal performance.

The material offers low thermal resistance, good electrical insulation and excellent conformability.

Known as BERGQUIST GAP FILLER 3500S35

 
packshot-grp-bergquist-gap-filler-tgf-3600-112241-11-2019.png
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Availability: stock
Dispatched within: 24h
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €49.13
incl. 23% TAX, excl. shipping costs

Regular price: €57.80

49.13
The lowest price during 30 days prior to the reduction: €58.82 If the product is sold for less than 30 days, the lowest price since the product went on sale is displayed.
Net price: €39.94
excl. 23% TAX, excl. shipping costs

Regular price: €46.99

The lowest price during 30 days prior to the reduction: €47.82 If the product is sold for less than 30 days, the lowest price since the product went on sale is displayed.
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Description

BERGQUIST GAP FILLER TGF 3600 is a high-performance silicone-based thermal interface material designed to improve heat transfer between electronic components and heat sinks or enclosures. It belongs to the category of gap fillers, materials specifically engineered to eliminate air gaps that reduce thermal efficiency.

Its soft and compliant structure allows excellent surface wetting, minimizing thermal resistance and enhancing overall thermal management performance.


Key features

  • thermal conductivity: 3.6 W/m·K

  • excellent conformability

  • low thermal resistance

  • good electrical insulation

  • silicone-based for stability and durability

  • easy application

  • stress-relieving properties between components


Typical applications

BERGQUIST GAP FILLER TGF 3600 is used in:

  • power electronics modules

  • LED systems

  • automotive electronics

  • telecommunications equipment

  • industrial electronics

  • CPU/GPU cooling systems


Technical data

Parameter Value
Technology silicone gap filler
Thermal conductivity 3.6 W/m·K
Hardness ~60 Shore 00
Density ~3.2 g/cm³
Operating temperature -60 to 200 °C
Dielectric strength ~6 kV/mm
Dielectric constant ~5.5
Colour grey

5. FAQ

What is BERGQUIST GAP FILLER TGF 3600 used for?
It is used to transfer heat between electronic components and heat sinks by filling air gaps.

What is the thermal conductivity of TGF 3600?
The thermal conductivity is approximately 3.6 W/m·K.

Is BERGQUIST GAP FILLER TGF 3600 electrically insulating?
Yes, it provides good dielectric insulation while maintaining thermal conductivity.

Where is TGF 3600 typically used?
It is commonly used in power electronics, LED systems, automotive electronics and industrial devices.

 
Files to download:

Files to download

BERGQUIST GAP FILLER TGF 3600 is a high-performance silicone-based thermal interface material designed to improve heat transfer between electronic components and heat sinks or enclosures. It belongs to the category of gap fillers, materials specifically engineered to eliminate air gaps that reduce thermal efficiency.

Its soft and compliant structure allows excellent surface wetting, minimizing thermal resistance and enhancing overall thermal management performance.


Key features

  • thermal conductivity: 3.6 W/m·K

  • excellent conformability

  • low thermal resistance

  • good electrical insulation

  • silicone-based for stability and durability

  • easy application

  • stress-relieving properties between components


Typical applications

BERGQUIST GAP FILLER TGF 3600 is used in:

  • power electronics modules

  • LED systems

  • automotive electronics

  • telecommunications equipment

  • industrial electronics

  • CPU/GPU cooling systems


Technical data

Parameter Value
Technology silicone gap filler
Thermal conductivity 3.6 W/m·K
Hardness ~60 Shore 00
Density ~3.2 g/cm³
Operating temperature -60 to 200 °C
Dielectric strength ~6 kV/mm
Dielectric constant ~5.5
Colour grey

5. FAQ

What is BERGQUIST GAP FILLER TGF 3600 used for?
It is used to transfer heat between electronic components and heat sinks by filling air gaps.

What is the thermal conductivity of TGF 3600?
The thermal conductivity is approximately 3.6 W/m·K.

Is BERGQUIST GAP FILLER TGF 3600 electrically insulating?
Yes, it provides good dielectric insulation while maintaining thermal conductivity.

Where is TGF 3600 typically used?
It is commonly used in power electronics, LED systems, automotive electronics and industrial devices.

 
Files to download:

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