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TECHNOMELT AS 8998 0,5kg
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking
Availability: stock
Dispatched within: 24h
TECHNOMELT AS 8998 18kg
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking
Availability: on order
Dispatched within: 6 months
TECHNOMELT PA 638 BLACK BG20KG
High performance thermoplastic polyamide designed to meet low pressure moulding process requirements.
Availability: medium quantity
Dispatched within: 24h
TECHNOMELT PA 646 BLACK BG 5KG
TECHNOMELT PA 646 is a black, high performance, polyamide material designed to meet low pressure molding process requirements.
Availability: last pieces
Dispatched within: 24h
TECHNOMELT PA 646 BLACK BG20KG
TECHNOMELT PA 646 is a black, high performance, polyamide material designed to meet low pressure molding process requirements.
Availability: stock
Dispatched within: 24h
TECHNOMELT PA 653 Amber 20kg
Physical setting, thermoplastic polyamide hotmelt used for molding applications.
Availability: stock
Dispatched within: 24h
TECHNOMELT PA 62 25kg
Cleaning agent for polyamides based on dimer fatty acid.
Availability: on order
Dispatched within: 24h
TECHNOMELT PA 62 5kg
Cleaning agent for polyamides based on dimer fatty acid.
Availability: on order
Dispatched within: 1 month
Translucent dielectric LOCTITE EDAG PF 455BC 1.0KG E&C
Screen printable, UV curable dielectric ink for plastic film. Excellent humidity resistance.
Availability: on order
Dispatched within: 1 month
Underfill LOCTITE ECCOBOND E 1216M, 55cc
Availability: on order
Dispatched within: 2 months
Underfill LOCTITE ECCOBOND FP4531 5ml
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
Availability: on order
Dispatched within: 1 month
Underfill LOCTITE ECCOBOND UF 1173 80gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: on order
Dispatched within: 2 months
