€13.23
€10.76
€32.79
€26.66
€12.18
€9.90
€17.22
€14.00
€78.47
€63.80
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LOCTITE STYCAST 2651MM 5kg
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Description
LOCTITE STYCAST 2651MM is a high-quality epoxy potting compound used for encapsulating and protecting electronic assemblies. Once cured, it forms a durable structure with excellent electrical insulation, high mechanical strength, and good chemical resistance.
The material provides reliable protection against moisture, contamination, and mechanical stress. Its dimensional stability and good adhesion to a wide range of materials make it suitable for various industrial electronics applications.
LOCTITE STYCAST 2651MM can be used with several curing agents (e.g., CAT 9, CAT 23LV, CAT 24LV), allowing the curing process and final properties to be tailored to specific application requirements.
Key benefits
-
two-component epoxy encapsulation compound
-
excellent electrical insulation properties
-
high mechanical strength
-
good chemical resistance
-
dimensional stability after curing
-
good adhesion to various substrates
-
compatible with multiple curing agents
Typical applications
-
potting and encapsulation of electronic components
-
protection of electronic assemblies from moisture and contaminants
-
industrial electronic modules
-
power supplies and transformers
-
electronics operating in demanding environments
Files to download
LOCTITE STYCAST 2651MM is a high-quality epoxy potting compound used for encapsulating and protecting electronic assemblies. Once cured, it forms a durable structure with excellent electrical insulation, high mechanical strength, and good chemical resistance.
The material provides reliable protection against moisture, contamination, and mechanical stress. Its dimensional stability and good adhesion to a wide range of materials make it suitable for various industrial electronics applications.
LOCTITE STYCAST 2651MM can be used with several curing agents (e.g., CAT 9, CAT 23LV, CAT 24LV), allowing the curing process and final properties to be tailored to specific application requirements.
Key benefits
-
two-component epoxy encapsulation compound
-
excellent electrical insulation properties
-
high mechanical strength
-
good chemical resistance
-
dimensional stability after curing
-
good adhesion to various substrates
-
compatible with multiple curing agents
Typical applications
-
potting and encapsulation of electronic components
-
protection of electronic assemblies from moisture and contaminants
-
industrial electronic modules
-
power supplies and transformers
-
electronics operating in demanding environments


226116767
elektronika@mcc.pl
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