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SI-COAT 77 400ml silicone coating PCB
Silicone resin varnish for use in electronics
Availability: medium quantity
Dispatched within: 24h
Silver ink LOCTITE ECI 1011 E&C 1kg - highest conductivity
LOCTITE ECI 1011 – High-Conductivity Silver Ink for Screen, Flexographic, and Gravure Printing. Intermetallic efect @ 150*C
Availability: on order
Dispatched within: 2 months
Silver ink LOCTITE ECI 1501 E&C 1kg - thermoformable
Made for one-time elongation during thermoformable process
Availability: on order
Dispatched within: 1 month
Solvent for uncured epoxies Loctite SF 7360 500ml
Aliphatic ester clear solvent cleaner for removing uncured adhesive and adhesive residue from PCBs. Fully compatible with epoxy adhesives.
Availability: medium quantity
Dispatched within: 24h
TECHNOMELT AS 8998 0,5kg
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking
Availability: medium quantity
Dispatched within: 24h
TECHNOMELT AS 8998 18kg
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking
Availability: medium quantity
Dispatched within: 6 months
TECHNOMELT PA 638 BLACK BG20KG
High performance thermoplastic polyamide designed to meet low pressure moulding process requirements.
Availability: stock
Dispatched within: 24h
TECHNOMELT PA 653 Amber 20kg
Physical setting, thermoplastic polyamide hotmelt used for molding applications.
Availability: stock
Dispatched within: 24h
TECHNOMELT PA 2302 0,5kg
This 1-part, low viscosity, thermoplastic hot melt adhesive is specially designed for molding applications.
Availability: medium quantity
Dispatched within: 24h
TECHNOMELT PA 62 25kg
Cleaning agent for polyamides based on dimer fatty acid.
Availability: on order
Dispatched within: 24h
TECHNOMELT PA 62 5kg
Cleaning agent for polyamides based on dimer fatty acid.
Availability: on order
Dispatched within: 1 month
TECHNOMELT PA 646 20kg BLACK – Black Polyamide Hot Melt for Low-Pressure Molding of Electronic Components
TECHNOMELT PA 646 BLACK is a black polyamide hot melt for low-pressure electronic molding. It offers excellent moisture and heat resistance, strong adhesion to plastics and metals, and safe encapsulation of fragile components.
Availability: stock
Dispatched within: 24h
TECHNOMELT PA 646 5kg BLACK – Black Polyamide Hot Melt for Low-Pressure Molding of Electronic Components
TECHNOMELT PA 646 BLACK is a black polyamide hot melt for low-pressure electronic molding. It offers excellent moisture and heat resistance, strong adhesion to plastics and metals, and safe encapsulation of fragile components.
Availability: medium quantity
Dispatched within: 24h
Thinner for Plastic 70 1L
Thinner do Plastic 70
Availability: medium quantity
Dispatched within: 24h
