€13.30
€10.81
€32.96
€26.80
€12.24
€9.95
€17.30
€14.07
€78.86
€64.12
€49.13
Regular price:
€57.80
€39.94
Regular price:
€46.99
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LOCTITE EA 9492 DC400ML
2-part epoxy adhesive formulated for applications where high temperature and/or high chemical resistance is required.
Known as: LOCTITE 9492
Availability: medium quantity
Dispatched within: 5 days
LOCTITE EA 9492 DC50ML
2-part epoxy adhesive formulated for applications where high temperature and/or high chemical resistance is required.
Known as: LOCTITE 9492
Availability: medium quantity
Dispatched within: 24h
LOCTITE EA 9497 DC400ML
LOCTITE EA 9497 is a grey, 2-part, medium viscosity, high performance epoxy adhesive offering high temperature resistance and thermal conductivity.
Availability: on order
Dispatched within: 1 month
LOCTITE EA 9514 CR300ML
LOCTITE EA 9514 is a grey, 1-part epoxy-based magnet bonder with high resistance to temperature and impact.
Known as: LOCTITE 9514
Availability: last pieces
Dispatched within: 5 days
LOCTITE EA E32 DC50ML
Grey, 2-part, toughened, high shear and peel strength, structural epoxy adhesive which has remarkable resistance to both static and dynamic loading
Known as: LOCTITE E32 A/B
Availability: medium quantity
Dispatched within: 2 months
LOCTITE ECCOBOND 3593, 30CC
LOCTITE 3593 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for chip size
packages.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 1173 15gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 55cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECCOBOND UF 3811 5cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 40 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECI 1006 E&C 1kg Fine-Line Silver Conductive Ink for Screen Printing - MOQ 5pcs
LOCTITE ECI 1006 E&C, Thermoplastic, Screen Printable, Conductive Ink
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1010 0,2kg Highly Conductive Silver Ink for Flexible Printed Circuits - MOQ 3pcs
LOCTITE ECI 1010 E&C, Thermoplastic, Screen Printable, Conductive Ink
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1010 1kg Highly Conductive Silver Ink for Flexible Printed Circuits
LOCTITE ECI 1010 E&C, Thermoplastic, Screen Printable, Conductive Ink
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1014 0.2kg – Flexible Silver Conductive Ink for Low-Temperature Drying
Electrically conductive silver ink with high conductivity and good stretchability
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1014 1kg – Flexible Silver Conductive Ink for Low-Temperature Drying
Electrically conductive silver ink with high conductivity and good stretchability
Availability: on order
Dispatched within: 1 month


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