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€11.70
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€18.66
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€32.20
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€42.74
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€34.75
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€19.39
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€19.32
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€13.65
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€11.10
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€18.87
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€15.34
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€42.47
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€34.53
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€10.74
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€11.93
€8.73
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€16.37
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€18.18
€13.31
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€14.78
€18.66
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€20.73
€15.17
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€13.09
€10.64
€33.59
€27.31
€12.05
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€17.03
€13.84
€77.60
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€57.80
€46.99
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LOCTITE EA 9492 DC50ML
2-part epoxy adhesive formulated for applications where high temperature and/or high chemical resistance is required.
Known as: LOCTITE 9492
Availability: medium quantity
Dispatched within: 24h
LOCTITE EA 9497 DC400ML
LOCTITE EA 9497 is a grey, 2-part, medium viscosity, high performance epoxy adhesive offering high temperature resistance and thermal conductivity.
Availability: on order
Dispatched within: 1 month
LOCTITE EA 9514 CR300ML
LOCTITE EA 9514 is a grey, 1-part epoxy-based magnet bonder with high resistance to temperature and impact.
Known as: LOCTITE 9514
Availability: last pieces
Dispatched within: 24h
LOCTITE EA E32 DC50ML
Grey, 2-part, toughened, high shear and peel strength, structural epoxy adhesive which has remarkable resistance to both static and dynamic loading
Known as: LOCTITE E32 A/B
Availability: medium quantity
Dispatched within: 2 months
LOCTITE ECCOBOND 3593, 30CC
LOCTITE 3593 is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for chip size
packages.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 1173 15gr
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3810 30ml - MOQ 10pcs
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
Availability: on order
Dispatched within: 2 months
LOCTITE ECCOBOND UF 3811 55cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 10 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECCOBOND UF 3811 5cc One-Component Epoxy Underfill for CSP and BGA Applications - MOQ 40 pcs
LOCTITE ECCOBOND UF 3811 is a one-component epoxy underfill for CSP and BGA. It flows at room temperature, cures quickly, and protects solder joints against thermal cycling. Reworkable, halogen-free, and NASA outgassing compliant.
Availability: on order
Dispatched within: 3 months
LOCTITE ECI 1006 E&C 1kg Fine-Line Silver Conductive Ink for Screen Printing - MOQ 5pcs
LOCTITE ECI 1006 E&C, Thermoplastic, Screen Printable, Conductive Ink
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1010 0,2kg Highly Conductive Silver Ink for Flexible Printed Circuits - MOQ 3pcs
LOCTITE ECI 1010 E&C, Thermoplastic, Screen Printable, Conductive Ink
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1010 1kg Highly Conductive Silver Ink for Flexible Printed Circuits
LOCTITE ECI 1010 E&C, Thermoplastic, Screen Printable, Conductive Ink
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1014 0.2kg – Flexible Silver Conductive Ink for Low-Temperature Drying
Electrically conductive silver ink with high conductivity and good stretchability
Availability: on order
Dispatched within: 2 months
LOCTITE ECI 1014 1kg – Flexible Silver Conductive Ink for Low-Temperature Drying
Electrically conductive silver ink with high conductivity and good stretchability
Availability: on order
Dispatched within: 1 month
Loctite ECI 4005 - Silver-Plated Copper Conductive Ink for Screen Printing
LOCTITE ECI 4005 is a highly conductive silver-plated copper ink for screen printing. It combines low sheet resistance with long-term stability under harsh conditions (1000 h at 85°C / 85% RH). Suitable for antennas, smart textiles, automotive interiors, and flexible heaters. A cost-effective alternative to standard silver inks.
Availability: Wkrótce w ofercie!
