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TECHNOMELT PA 2302 0,5kg
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Description
TECHNOMELT® PA 2302 BLACK is a 1-part polyamide hot melt adhesive formulated for molding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. Ideal for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors. A versatile adhesive for a variety of substrates.
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TECHNOMELT® PA 2302 BLACK is a 1-part polyamide hot melt adhesive formulated for molding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. Ideal for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors. A versatile adhesive for a variety of substrates.
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