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Epoxy resin LOCTITE STYCAST 2850MT 1kg
LOCTITE STYCAST 2850 MT is a two-component epoxy encapsulation compound designed for potting and protecting electronic components. The material provides high thermal conductivity, good mechanical stability, and excellent electrical insulation, making it suitable for applications requiring efficient heat dissipation and reliable electronic protection.
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Description
LOCTITE STYCAST 2850 MT is a high-performance epoxy potting compound used for protecting and encapsulating electronic assemblies in demanding industrial applications. Once cured, the material forms a durable structure with high mechanical strength, chemical resistance, and excellent electrical insulation properties.
Its high thermal conductivity and dimensional stability help protect sensitive electronic components from overheating and thermal stress. The material can be combined with various curing agents (e.g., CAT 9, CAT 23LV, CAT 24LV, CAT 27-1), allowing the curing process and final properties to be optimized for specific applications.
Key benefits
-
two-component epoxy encapsulation compound
-
high thermal conductivity
-
excellent electrical insulation
-
good mechanical strength and durability
-
good chemical resistance
-
adaptable curing properties with different catalysts
-
reliable protection for electronic assemblies
Typical applications
-
potting and encapsulation of electronic components
-
power electronics and industrial modules
-
power supplies and transformers
-
high-voltage modules
-
thermal management applications
Files to download:
Files to download
LOCTITE STYCAST 2850 MT is a high-performance epoxy potting compound used for protecting and encapsulating electronic assemblies in demanding industrial applications. Once cured, the material forms a durable structure with high mechanical strength, chemical resistance, and excellent electrical insulation properties.
Its high thermal conductivity and dimensional stability help protect sensitive electronic components from overheating and thermal stress. The material can be combined with various curing agents (e.g., CAT 9, CAT 23LV, CAT 24LV, CAT 27-1), allowing the curing process and final properties to be optimized for specific applications.
Key benefits
-
two-component epoxy encapsulation compound
-
high thermal conductivity
-
excellent electrical insulation
-
good mechanical strength and durability
-
good chemical resistance
-
adaptable curing properties with different catalysts
-
reliable protection for electronic assemblies
Typical applications
-
potting and encapsulation of electronic components
-
power electronics and industrial modules
-
power supplies and transformers
-
high-voltage modules
-
thermal management applications
Files to download:
Technical data
| Minimum order quantity | 8 |
Shipping costs
The price does not include any possible payment costs
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