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Chipbonder for dispensing LOCTITE 3609 30CC EFD

Availability: medium quantity
Dispatched within: 24h
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €64.81
incl. 23% TAX, excl. shipping costs
64.81
Net price: €52.69
excl. 23% TAX, excl. shipping costs
quantity pc.

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Description

LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.
  • Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
  • Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
  • One component - requires no mixing
  • Can be used in lead free wave solder with both water-based and alcohol-based fluxes
Files to download:

Files to download

LOCTITE® 3609 is a dark red, viscous epoxy gel designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.
  • Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
  • Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
  • One component - requires no mixing
  • Can be used in lead free wave solder with both water-based and alcohol-based fluxes
Files to download:

Technical data

18-25*C No
2-8*C Yes
0*C No
-20*C No
-40*C No

Shipping costs The price does not include any possible payment costs

Shipping country:

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