BERGQUIST GAP PAD TGP 1000VOUS
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Gap Pad VO Ultra Soft is a cost-effective material, recommended for extremely low stress applications that require a
thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with steps, rough surfaces, and high stack up tolerances. The viscoelastic nature of the material also gives excellent low stress vibration dampening and shock absorbing characteristics.
GP Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare leaded devices.
GP Ultra Soft is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling and enhanced puncture, shear, and tear resistance.
GP Ultra Soft is offered in thicknesses from 0.020" to 0.250" with the rubber-coated carrier on one side and removable protective liner on the naturally tacky side of the material. Material is
available in die-cut parts and sheets. Standard sheet size is 8" X 16", with or without
adhesive, thickness tolerance is ± 5% of material thickness.
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