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Zinc and Silicone-Free Thermal Paste 10ml 1,5W/mK
Zinc and Silicone-Free Thermal Paste 779.010.NGZ15NF is a thermally conductive interface material designed to improve heat transfer between electronic components and heat sinks. Its silicone-free and zinc-oxide-free formulation provides stable performance, excellent wettability and low thermal resistance.
Ideal for electronic assemblies requiring reliable thermal management.
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Description
Zinc and Silicone-Free Thermal Paste 779.010.NGZ15NF is a thermal interface material developed for efficient heat dissipation in electronic and electromechanical systems. The paste is completely silicone-free and zinc-oxide-free, making it suitable for applications where these materials must be avoided.
The compound provides thermal conductivity of approximately 1.5 W/mK, ensuring effective heat transfer between contacting surfaces. Its excellent wettability and low thermal resistance allow it to fill microscopic air gaps between components, significantly improving thermal performance.
Thanks to its specially developed formulation, the paste offers long-term storage stability and low viscosity, enabling easy dispensing and precise application. It can be applied using dispensing systems, screen printing or stencil printing, which makes it suitable for both industrial manufacturing and maintenance operations.
The material maintains stable properties over a wide temperature range from approximately -50°C to +180°C, ensuring reliable operation even in demanding thermal environments.
Applications
Suitable for use in:
-
power electronics and industrial electronics
-
heat sinks and cooling assemblies
-
transistors, diodes and semiconductors
-
power supplies and control units
-
electronic modules requiring thermal management
Key features
-
silicone-free and zinc oxide-free thermal compound
-
thermal conductivity approx. 1.5 W/mK
-
excellent wettability and low thermal resistance
-
low viscosity for easy dispensing
-
suitable for screen and stencil printing
-
long-term storage stability
-
operating temperature range -50°C to +180°C
Files to download:
Files to download
Zinc and Silicone-Free Thermal Paste 779.010.NGZ15NF is a thermal interface material developed for efficient heat dissipation in electronic and electromechanical systems. The paste is completely silicone-free and zinc-oxide-free, making it suitable for applications where these materials must be avoided.
The compound provides thermal conductivity of approximately 1.5 W/mK, ensuring effective heat transfer between contacting surfaces. Its excellent wettability and low thermal resistance allow it to fill microscopic air gaps between components, significantly improving thermal performance.
Thanks to its specially developed formulation, the paste offers long-term storage stability and low viscosity, enabling easy dispensing and precise application. It can be applied using dispensing systems, screen printing or stencil printing, which makes it suitable for both industrial manufacturing and maintenance operations.
The material maintains stable properties over a wide temperature range from approximately -50°C to +180°C, ensuring reliable operation even in demanding thermal environments.
Applications
Suitable for use in:
-
power electronics and industrial electronics
-
heat sinks and cooling assemblies
-
transistors, diodes and semiconductors
-
power supplies and control units
-
electronic modules requiring thermal management
Key features
-
silicone-free and zinc oxide-free thermal compound
-
thermal conductivity approx. 1.5 W/mK
-
excellent wettability and low thermal resistance
-
low viscosity for easy dispensing
-
suitable for screen and stencil printing
-
long-term storage stability
-
operating temperature range -50°C to +180°C
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