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TECHNOMELT PA 646 5kg BLACK – Black Polyamide Hot Melt for Low-Pressure Molding of Electronic Components
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Description
TECHNOMELT PA 646 BLACK is a one-component, thermoplastic polyamide hot melt adhesive designed for low-pressure molding processes. Thanks to its low viscosity, it allows safe encapsulation of delicate electronic components without damage during processing.
Once applied, it forms a flexible yet durable protective shell that offers excellent resistance to moisture, chemicals, and temperatures from -40°C to +130°C. The material adheres well to a wide range of substrates including plastics (ABS, PC), FR4, and preheated metals. It features high elasticity (650% elongation), strong adhesion, and stable dielectric properties, making it ideal for demanding electronic applications.
Applications:
-
Sensor encapsulation and overmolding
-
Environmental protection for electronic modules
-
Integrated housings for SMT components
-
Molding on FR4, ABS, PC, and metals
Key Properties:
-
Type: Black polyamide hot melt adhesive
-
Molding temperature: 200–240°C
-
Operating range: -40°C to +130°C
-
Viscosity @230°C: 3,000 mPa·s
-
Softening point: 170–180°C
-
Hardness: 92A (Shore)
-
Elongation at break: 650%
-
Temperature creep resistance: 155°C
-
Tensile strength: 9 MPa
-
Dielectric strength: 22 kV/mm
-
Volume resistivity: 1.7 × 10¹² Ω·cm
-
Dielectric stability up to 50 GHz
Files to download:
Files to download
TECHNOMELT PA 646 BLACK is a one-component, thermoplastic polyamide hot melt adhesive designed for low-pressure molding processes. Thanks to its low viscosity, it allows safe encapsulation of delicate electronic components without damage during processing.
Once applied, it forms a flexible yet durable protective shell that offers excellent resistance to moisture, chemicals, and temperatures from -40°C to +130°C. The material adheres well to a wide range of substrates including plastics (ABS, PC), FR4, and preheated metals. It features high elasticity (650% elongation), strong adhesion, and stable dielectric properties, making it ideal for demanding electronic applications.
Applications:
-
Sensor encapsulation and overmolding
-
Environmental protection for electronic modules
-
Integrated housings for SMT components
-
Molding on FR4, ABS, PC, and metals
Key Properties:
-
Type: Black polyamide hot melt adhesive
-
Molding temperature: 200–240°C
-
Operating range: -40°C to +130°C
-
Viscosity @230°C: 3,000 mPa·s
-
Softening point: 170–180°C
-
Hardness: 92A (Shore)
-
Elongation at break: 650%
-
Temperature creep resistance: 155°C
-
Tensile strength: 9 MPa
-
Dielectric strength: 22 kV/mm
-
Volume resistivity: 1.7 × 10¹² Ω·cm
-
Dielectric stability up to 50 GHz
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