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TECHNOMELT PA 646 20kg BLACK – Black Polyamide Hot Melt for Low-Pressure Molding of Electronic Components

TECHNOMELT PA 646 BLACK is a black polyamide hot melt for low-pressure electronic molding. It offers excellent moisture and heat resistance, strong adhesion to plastics and metals, and safe encapsulation of fragile components.

Availability: medium quantity

Dispatched within: 24h

Delivery: The price does not include any possible payment costs check the delivery methods

Gross price: €538.81

incl. 23% TAX, excl. shipping costs

538.81

Net price: €438.06

excl. 23% TAX, excl. shipping costs

quantity pc.

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Product code: 1055521

Safety

Description

TECHNOMELT PA 646 BLACK is a one-component, thermoplastic polyamide hot melt adhesive designed for low-pressure molding processes. Thanks to its low viscosity, it allows safe encapsulation of delicate electronic components without damage during processing.

Once applied, it forms a flexible yet durable protective shell that offers excellent resistance to moisture, chemicals, and temperatures from -40°C to +130°C. The material adheres well to a wide range of substrates including plastics (ABS, PC), FR4, and preheated metals. It features high elasticity (650% elongation), strong adhesion, and stable dielectric properties, making it ideal for demanding electronic applications.

Applications:

Sensor encapsulation and overmolding
Environmental protection for electronic modules
Integrated housings for SMT components
Molding on FR4, ABS, PC, and metals

Key Properties:

Type: Black polyamide hot melt adhesive
Molding temperature: 200–240°C
Operating range: -40°C to +130°C
Viscosity @230°C: 3,000 mPa·s
Softening point: 170–180°C
Hardness: 92A (Shore)
Elongation at break: 650%
Temperature creep resistance: 155°C
Tensile strength: 9 MPa
Dielectric strength: 22 kV/mm
Volume resistivity: 1.7 × 10¹² Ω·cm
Dielectric stability up to 50 GHz