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LOCTITE ABLESTIK 144A 1kg
LOCTITE ABLESTIK 144A is a black, one-component epoxy adhesive designed for assembly applications requiring high mechanical strength and temperature resistance. The material is solvent-free, requires no additional catalyst and is heat cured.
With an operating temperature range of −62°C to +200°C, 90 Shore D hardness and a typical lap shear strength of 15 MPa, LOCTITE ABLESTIK 144A is suitable for demanding bonding applications. Elevated temperatures enable very fast curing.
Exp. 19-11-2026
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Description
LOCTITE ABLESTIK 144A is a one-component, heat-cured epoxy adhesive developed for assembly applications. It is supplied ready for application, eliminating the need to measure and mix separate components or use an additional catalyst.
The solvent-free adhesive can be used on a wide variety of substrates. Once cured, it forms a hard and mechanically strong bond with a typical tensile lap shear strength of 15 N/mm² (15 MPa) at 25°C.
A key advantage of LOCTITE ABLESTIK 144A is its wide operating temperature range of −62°C to +200°C. The cured material provides a glass transition temperature of 107°C, hardness of 90 Shore D and low water absorption of only 0.07% after 24 hours at room temperature.
Different heat cure profiles can be selected according to production requirements. The adhesive can be cured for 4 hours at 80°C, while elevated temperatures can significantly reduce processing time – down to 8 minutes at 180°C.
Key features
- one-component epoxy adhesive
- heat cured
- operating temperature: −62°C to +200°C
- rapid cure at elevated temperatures
- no additional catalyst required
- solvent-free formulation
- hardness: 90 Shore D
- lap shear strength: 15 MPa
- glass transition temperature: 107°C
- thermal conductivity: 0.63 W/m·K
- volume resistivity: 1 × 10¹⁴ Ω·cm
- low water absorption
- black colour
Technical data
| Parameter | Value |
|---|---|
| Technology | Epoxy |
| Components | One-component |
| Cure | Heat cure |
| Appearance | Black |
| Application | Assembly |
| Solvent content | Solvent-free |
| Viscosity at 25°C | 93,000 mPa·s |
| Density | 1.55 g/cm³ |
| Operating temperature | −62°C to +200°C |
| Hardness | 90 Shore D |
| Glass transition temperature | 107°C |
| Thermal conductivity | 0.63 W/m·K |
| CTE | 48 × 10⁻⁶ K⁻¹ |
| Water absorption, 24 h / RT | 0.07% |
| Volume resistivity at 25°C | 1 × 10¹⁴ Ω·cm |
| Tensile lap shear strength at 25°C | 15 N/mm² (15 MPa) |
Recommended cure schedules
| Temperature | Cure time |
|---|---|
| 80°C | 4 hours |
| 120°C | 1 hour |
| 150°C | 30 minutes |
| 180°C | 8 minutes |
Typical gel times are 10 minutes at 120°C, 2 minutes at 150°C and 30 seconds at 180°C.
Files to download:
Files to download
LOCTITE ABLESTIK 144A is a one-component, heat-cured epoxy adhesive developed for assembly applications. It is supplied ready for application, eliminating the need to measure and mix separate components or use an additional catalyst.
The solvent-free adhesive can be used on a wide variety of substrates. Once cured, it forms a hard and mechanically strong bond with a typical tensile lap shear strength of 15 N/mm² (15 MPa) at 25°C.
A key advantage of LOCTITE ABLESTIK 144A is its wide operating temperature range of −62°C to +200°C. The cured material provides a glass transition temperature of 107°C, hardness of 90 Shore D and low water absorption of only 0.07% after 24 hours at room temperature.
Different heat cure profiles can be selected according to production requirements. The adhesive can be cured for 4 hours at 80°C, while elevated temperatures can significantly reduce processing time – down to 8 minutes at 180°C.
Key features
- one-component epoxy adhesive
- heat cured
- operating temperature: −62°C to +200°C
- rapid cure at elevated temperatures
- no additional catalyst required
- solvent-free formulation
- hardness: 90 Shore D
- lap shear strength: 15 MPa
- glass transition temperature: 107°C
- thermal conductivity: 0.63 W/m·K
- volume resistivity: 1 × 10¹⁴ Ω·cm
- low water absorption
- black colour
Technical data
| Parameter | Value |
|---|---|
| Technology | Epoxy |
| Components | One-component |
| Cure | Heat cure |
| Appearance | Black |
| Application | Assembly |
| Solvent content | Solvent-free |
| Viscosity at 25°C | 93,000 mPa·s |
| Density | 1.55 g/cm³ |
| Operating temperature | −62°C to +200°C |
| Hardness | 90 Shore D |
| Glass transition temperature | 107°C |
| Thermal conductivity | 0.63 W/m·K |
| CTE | 48 × 10⁻⁶ K⁻¹ |
| Water absorption, 24 h / RT | 0.07% |
| Volume resistivity at 25°C | 1 × 10¹⁴ Ω·cm |
| Tensile lap shear strength at 25°C | 15 N/mm² (15 MPa) |
Recommended cure schedules
| Temperature | Cure time |
|---|---|
| 80°C | 4 hours |
| 120°C | 1 hour |
| 150°C | 30 minutes |
| 180°C | 8 minutes |
Typical gel times are 10 minutes at 120°C, 2 minutes at 150°C and 30 seconds at 180°C.
Files to download:
Technical data
| 18-25*C | Yes |
| 2-8*C | Yes |
| 0*C | No |
| -20*C | No |
| -40*C | No |
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