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LOCTITE® 315 + SF 7386 – Thermally Conductive Adhesive Kit with Activator for Electronics and Heat Sinks 25/18ml
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Description
LOCTITE® 315 is a one-component, thermally conductive acrylic adhesive designed for bonding electronic components to heat sinks or PCBs. Its self-shimming feature creates a consistent 5–6 mil gap, ensuring electrical insulation while maintaining excellent thermal conductivity (0.808 W/m·K). The adhesive offers controlled strength, allowing for field and service repairs when needed.
LOCTITE® 315 is ideal for bonding transformers, transistors, and other heat-generating components. It requires LOCTITE® SF 7386 activator for curing, which initiates the adhesive bond and accelerates fixture time.
LOCTITE® SF 7386 is a low-viscosity activator specifically formulated for curing Loctite toughened acrylic adhesives. When applied to one bonding surface, it ensures fast and efficient curing, even in challenging assembly conditions.
This kit enables quick, reliable, and durable bonding with outstanding heat dissipation and long-term performance – even during continuous operation under temperature cycling from 15°C to 100°C. A professional-grade solution designed for demanding industrial applications where precision and performance matter.
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LOCTITE® 315 is a one-component, thermally conductive acrylic adhesive designed for bonding electronic components to heat sinks or PCBs. Its self-shimming feature creates a consistent 5–6 mil gap, ensuring electrical insulation while maintaining excellent thermal conductivity (0.808 W/m·K). The adhesive offers controlled strength, allowing for field and service repairs when needed.
LOCTITE® 315 is ideal for bonding transformers, transistors, and other heat-generating components. It requires LOCTITE® SF 7386 activator for curing, which initiates the adhesive bond and accelerates fixture time.
LOCTITE® SF 7386 is a low-viscosity activator specifically formulated for curing Loctite toughened acrylic adhesives. When applied to one bonding surface, it ensures fast and efficient curing, even in challenging assembly conditions.
This kit enables quick, reliable, and durable bonding with outstanding heat dissipation and long-term performance – even during continuous operation under temperature cycling from 15°C to 100°C. A professional-grade solution designed for demanding industrial applications where precision and performance matter.
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