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Flux Multicore X33-12i 5L
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Description
Maximum process window and sustained activity – without resin
High speed soldering on conventional leaded and SMD components – no bridges or icicles
Good through hole penetration
No cleaning – reduces costs
Minimal residues to interfere with ATE probes without cleaning
Compatible with rosin and OSP based surface preservatives
Foam, spray or wave application
Files to download:
Files to download
Maximum process window and sustained activity – without resin
High speed soldering on conventional leaded and SMD components – no bridges or icicles
Good through hole penetration
No cleaning – reduces costs
Minimal residues to interfere with ATE probes without cleaning
Compatible with rosin and OSP based surface preservatives
Foam, spray or wave application
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