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Chipbonder for dispensing LOCTITE 3619 10ml EFD
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
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5
Safety
Description
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
- One component
- High dispense speed
- High wet strength
Files to download
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
- One component
- High dispense speed
- High wet strength
Technical data
| 18-25*C | No |
| 2-8*C | Yes |
| 0*C | No |
| -20*C | No |
| -40*C | No |
| Minimum order quantity | 10 |
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