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Chipbonder for dispensing LOCTITE 3619 10ml EFD
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Description
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
- One component
- High dispense speed
- High wet strength
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LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
- One component
- High dispense speed
- High wet strength
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