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BERGQUIST LIQUI FORM TLF LF3500 150ml
BERGQUIST LIQUI FORM TLF LF3500 is a high-performance, one-part silicone gel with excellent thermal conductivity (3.5 W/m·K). It requires no mixing or curing, offering easy dispensing and reliable long-term performance. Ideal for applications demanding low assembly pressure and superior heat dissipation.
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Description
BERGQUIST LIQUI FORM TLF LF3500 is a thermally conductive, pre-cured silicone gel designed for demanding thermal management applications. With a thermal conductivity of 3.5 W/m·K and a wide operating temperature range from -60°C to 200°C, it provides excellent heat transfer while minimizing mechanical stress during assembly.
This thixotropic material conforms to component surfaces and remains in place, ensuring consistent thermal contact. It is pre-cured and ready to use — no mixing, curing, or refrigeration required.
Typical applications include handheld devices, die-to-lid interfaces, gap filling between heat-generating components and heat sinks, and reworkable high-value assemblies such as BGA, PGA, and PPGA packages.
UL flammability rating: UL 94 V-0.
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BERGQUIST LIQUI FORM TLF LF3500 is a thermally conductive, pre-cured silicone gel designed for demanding thermal management applications. With a thermal conductivity of 3.5 W/m·K and a wide operating temperature range from -60°C to 200°C, it provides excellent heat transfer while minimizing mechanical stress during assembly.
This thixotropic material conforms to component surfaces and remains in place, ensuring consistent thermal contact. It is pre-cured and ready to use — no mixing, curing, or refrigeration required.
Typical applications include handheld devices, die-to-lid interfaces, gap filling between heat-generating components and heat sinks, and reworkable high-value assemblies such as BGA, PGA, and PPGA packages.
UL flammability rating: UL 94 V-0.
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