226116767
elektronika@mcc.pl
Menu
€13.65
Regular price:
€15.17
€11.10
Regular price:
€12.33
€18.87
Regular price:
€20.96
€15.34
Regular price:
€17.04
€42.47
Regular price:
€47.18
€34.53
Regular price:
€38.36
€10.74
Regular price:
€11.93
€8.73
Regular price:
€9.70
€16.37
Regular price:
€18.18
€13.31
Regular price:
€14.78
€18.66
Regular price:
€20.73
€15.17
Regular price:
€16.85
€14.38
Regular price:
€15.98
€11.70
Regular price:
€12.99
€18.66
Regular price:
€20.73
€15.17
Regular price:
€16.85
€39.61
Regular price:
€44.01
€32.20
Regular price:
€35.78
€42.74
Regular price:
€47.49
€34.75
Regular price:
€38.61
€19.39
Regular price:
€21.54
€15.76
Regular price:
€17.51
€23.77
Regular price:
€26.41
€19.32
Regular price:
€21.47
€13.09
€10.64
€33.59
€27.31
€12.05
€9.79
€17.03
€13.84
€77.60
€63.09
€57.80
€46.99
Login
BERGQUIST LIQUI FORM TLF LF3500 150ml
BERGQUIST LIQUI FORM TLF LF3500 is a high-performance, one-part silicone gel with excellent thermal conductivity (3.5 W/m·K). It requires no mixing or curing, offering easy dispensing and reliable long-term performance. Ideal for applications demanding low assembly pressure and superior heat dissipation.
product unavailable
add to wish list
0
Safety
Description
BERGQUIST LIQUI FORM TLF LF3500 is a thermally conductive, pre-cured silicone gel designed for demanding thermal management applications. With a thermal conductivity of 3.5 W/m·K and a wide operating temperature range from -60°C to 200°C, it provides excellent heat transfer while minimizing mechanical stress during assembly.
This thixotropic material conforms to component surfaces and remains in place, ensuring consistent thermal contact. It is pre-cured and ready to use — no mixing, curing, or refrigeration required.
Typical applications include handheld devices, die-to-lid interfaces, gap filling between heat-generating components and heat sinks, and reworkable high-value assemblies such as BGA, PGA, and PPGA packages.
UL flammability rating: UL 94 V-0.
Files to download
BERGQUIST LIQUI FORM TLF LF3500 is a thermally conductive, pre-cured silicone gel designed for demanding thermal management applications. With a thermal conductivity of 3.5 W/m·K and a wide operating temperature range from -60°C to 200°C, it provides excellent heat transfer while minimizing mechanical stress during assembly.
This thixotropic material conforms to component surfaces and remains in place, ensuring consistent thermal contact. It is pre-cured and ready to use — no mixing, curing, or refrigeration required.
Typical applications include handheld devices, die-to-lid interfaces, gap filling between heat-generating components and heat sinks, and reworkable high-value assemblies such as BGA, PGA, and PPGA packages.
UL flammability rating: UL 94 V-0.
All reviews (positive and negative) are displayed. We don't verify that they come from customers who have purchased the product.