226116767
elektronika@mcc.pl
Menu
- CHEMISTRY FOR AUTOMOTIVE(167)
- 3D PRINTING | AM(84)
- HENKEL FOR ELECTRONICS(154)
- Solder materials(38)
- CHEMISTRY FOR INDUSTRY(348)
- THERMAL INTERFACE MATERIALS(57)
- ACCESSORIES(75)
- ELECTRONICON FOIL CAPACITORS(0)
- MECCAL HEATSINKS(0)
- New products
- Products on sale
€34.43
Regular price:
€38.26
€28.00
Regular price:
€31.10
€10.72
Regular price:
€11.91
€8.71
Regular price:
€9.68
€10.72
Regular price:
€11.91
€8.71
Regular price:
€9.68
€16.33
Regular price:
€18.15
€13.28
Regular price:
€14.75
€75.73
Regular price:
€84.15
€61.57
Regular price:
€68.41
€18.62
Regular price:
€20.69
€15.14
Regular price:
€16.82
€13.63
Regular price:
€15.14
€11.08
Regular price:
€12.31
€14.36
Regular price:
€15.95
€11.67
Regular price:
€12.97
€20.91
Regular price:
€23.23
€17.00
Regular price:
€18.89
€18.83
Regular price:
€20.92
€15.31
Regular price:
€17.01
€9.36
Regular price:
€10.40
€7.61
Regular price:
€8.46
€32.04
Regular price:
€35.60
€26.05
Regular price:
€28.94
€13.06
€10.62
€32.36
€26.31
€12.02
€9.77
€16.99
€13.82
€77.44
€62.96
€57.80
€46.99
Login
BERGQUIST LIQUI BOND TLB SA3500 50cc
BERGQUIST LIQUI BOND TLB SA3500 is a two component, liquid silicone adhesive designed to offer high bond strength in extreme environments.
Known as: Liqui-Bond® SA 3505
product unavailable
add to wish list
5
Safety
Description
BERGQUIST® LIQUI BOND TLB SA3500 is a thermally conductive, high performance adhesive material that, after mixing, begins to cure at room temperature but can also be accelerated by using heat. Once cured, this product maintains an excellent structural bond that can withstand severe environmental conditions and eliminates the need for mechanical fasteners. The mild elastic properties of the product assist in relieving Coefficient of Thermal Expansion (CTE) stresses during thermal cycling.
- Eliminates need for mechanical fasteners
- Thermal Conductivity: 3.5 W/m-K
- Maintains structural bond in severe-environment applications
- Room Temperature Storage
Files to download
BERGQUIST® LIQUI BOND TLB SA3500 is a thermally conductive, high performance adhesive material that, after mixing, begins to cure at room temperature but can also be accelerated by using heat. Once cured, this product maintains an excellent structural bond that can withstand severe environmental conditions and eliminates the need for mechanical fasteners. The mild elastic properties of the product assist in relieving Coefficient of Thermal Expansion (CTE) stresses during thermal cycling.
- Eliminates need for mechanical fasteners
- Thermal Conductivity: 3.5 W/m-K
- Maintains structural bond in severe-environment applications
- Room Temperature Storage
All reviews (positive and negative) are displayed. We don't verify that they come from customers who have purchased the product.