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BERGQUIST HI FLOW THF 1600P 0.005" 0,127mm 5,5"x5,5"
BERGQUIST HI FLOW THF 1600P is an electrically insulating, thermally conductive, and polyimide reinforced adhesive with excellent voltage breakdown and thermal performance.
Known as: Hi-Flow® 300P
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Description
BERGQUIST® HI FLOW THF 1600P is a thermally conductive 55°C phase change material, coated with a thermally conductive polyimide film that provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The 55°C phase change temperature reduces issues caused by shipping and handling and the easy release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices that require electrical isolation to the heat sink.
- Thermal impedance: 0.13°C in2/W @ 25 psi
- Outstanding thermal performance in an insulated pad
- Excellent cut-through resistance
- Excellent dielectric performance
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BERGQUIST® HI FLOW THF 1600P is a thermally conductive 55°C phase change material, coated with a thermally conductive polyimide film that provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The 55°C phase change temperature reduces issues caused by shipping and handling and the easy release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices that require electrical isolation to the heat sink.
- Thermal impedance: 0.13°C in2/W @ 25 psi
- Outstanding thermal performance in an insulated pad
- Excellent cut-through resistance
- Excellent dielectric performance
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