BERGQUIST GAP PAD TGP HC5000 0.08" 8x16"

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Dispatched within: 1 month
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €202.70
incl. 23% TAX, excl. shipping costs
202.70
Net price: €164.80
excl. 23% TAX, excl. shipping costs
quantity pc.

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Description

BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Soft, fibreglass reinforced insulation pad - high performance

  • Silicone-based
  • Fiberglass reinforced for shear and tear resistance
  • Thermal conductivity: 5 W/m-K (ASTM D5470)
  • High compliance, low compression stress

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BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.

Soft, fibreglass reinforced insulation pad - high performance

  • Silicone-based
  • Fiberglass reinforced for shear and tear resistance
  • Thermal conductivity: 5 W/m-K (ASTM D5470)
  • High compliance, low compression stress

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