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BERGQUIST GAP PAD TGP HC3000 0.03" 8x16"
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Description
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
Soft, fibreglass reinforced insulation pad - low stress applications
- Thermal conductivity: 3.0 W/m-K (ASTM D5470)
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
Soft, fibreglass reinforced insulation pad - low stress applications
- Thermal conductivity: 3.0 W/m-K (ASTM D5470)
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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