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BERGQUIST GAP PAD TGP EMI 1mm 8x16"

This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides electromagnetic energy absorption at frequencies of 1GHz and higher. 

Highly conformable gap pad filler for electromagnetic energy absorption  

Known as: Gap Pad EMI 1.0

Availability: on order
Dispatched within: 2 months
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €101.41
incl. 23% TAX, excl. shipping costs
101.41
Net price: €82.45
excl. 23% TAX, excl. shipping costs
quantity pc.

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Description

BERGQUIST GAP PAD TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent, natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side. 

Highly conformable gap pad filler for electromagnetic energy absorption  

  • Thermal conductivity: 1.0 W/m-K 
  • Electromagnetic Interference (EMI) absorbing 
  • Fiberglass reinforced for puncture, shear & tear resistance 
  • Highly conformable, low hardness 
Files to download:

Files to download

BERGQUIST GAP PAD TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent, natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side. 

Highly conformable gap pad filler for electromagnetic energy absorption  

  • Thermal conductivity: 1.0 W/m-K 
  • Electromagnetic Interference (EMI) absorbing 
  • Fiberglass reinforced for puncture, shear & tear resistance 
  • Highly conformable, low hardness 
Files to download:

Shipping costs The price does not include any possible payment costs

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