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BERGQUIST GAP PAD TGP 18000SF
Enabling Higher Bandwidth and Processing Power through Effective Thermal Management
Thermal conductivity 18W/mK
Electrically insulative
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5
Safety
Description
- High thermal conductivity
- Requires more interface pressure for ideal performance
- Applications with optimized strain%
- Electrically insulative
- Non-Silicone resin system
- Oriented filler for ultra high thermal conductivity − Best in class
- No Siloxane/Polymer Bleed or Off-gassing
- Optional PSA for improved tack
Files to download
- High thermal conductivity
- Requires more interface pressure for ideal performance
- Applications with optimized strain%
- Electrically insulative
- Non-Silicone resin system
- Oriented filler for ultra high thermal conductivity − Best in class
- No Siloxane/Polymer Bleed or Off-gassing
- Optional PSA for improved tack
All reviews (positive and negative) are displayed. We don't verify that they come from customers who have purchased the product.