to checkout total: €0.00

» Home page
» THERMAL INTERFACE MATERIALS
» Gap Fillers
» BERGQUIST GAP FILLER TGF 3000SF 50cc

226116767

elektronika@mcc.pl

CHEMISTRY FOR AUTOMOTIVE(161)
3D PRINTING | AM(81)
HENKEL FOR ELECTRONICS(128)
Solder materials(38)
CHEMISTRY FOR INDUSTRY(344)
THERMAL INTERFACE MATERIALS(53)
- Gap Fillers(10)
- Thermal conductive adhesives(14)
- Phase change materials(2)
- Sil, Poly & Q-Pad(1)
- Thermal Grease(3)
- Gap Pad(21)
- Film adhesives(1)
- Bond Ply(1)
ACCESSORIES(66)
ELECTRONICON FOIL CAPACITORS(0)
MECCAL HEATSINKS(0)
New products
Products on sale

Special offer

LOCTITE 435 50gr

€51.15

Regular price: ~~€55.36~~

Lowest price: €55.36

pc.

LOCTITE 276 50ml

€45.59

Regular price: ~~€47.99~~

Lowest price: €43.19

pc.

TEROSON® RB 81 High-quality butyl sealing compound 40X1,5, 40M

€69.53

Regular price: ~~€77.25~~

Lowest price: €77.25

pc.

Product of the Day

TEROSON MS 939 BLACK CR290ML

€13.23

pc.

LOCTITE 382 / SF 7455

€32.77

pc.

TEROSON MS 930 GREY CR310ML

€12.17

pc.

TEROSON MS 930 GREY FC570ML

€17.21

pc.

TEROSON PU 9225 250ml

€78.42

pc.

Forgot your password?

Create an account

BERGQUIST GAP FILLER TGF 3000SF 50cc

Availability: on order

Dispatched within: 2 months

Delivery: The price does not include any possible payment costs check the delivery methods

Gross price: €54.51

incl. 23% TAX, excl. shipping costs

54.51

Net price: €44.31

excl. 23% TAX, excl. shipping costs

quantity pc.

product unavailable

add to wish list

Rating:

Vendor:

Product code: 2746204

Safety

Description

BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler that is curable at room temperature and is suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent solution in the assembly of high-performance power devices.

Thermal Conductivity: 3.0 W/m-K
Dispensable liquid, 2K Silicone free Gap Filler
Room temperature cure - no oven required
Low compression stress during assembly

Files to download

Thermal Conductivity: 3.0 W/m-K
Dispensable liquid, 2K Silicone free Gap Filler
Room temperature cure - no oven required
Low compression stress during assembly

Shipping costs The price does not include any possible payment costs

Shipping country:

Product reviews (0)

All reviews (positive and negative) are displayed. We don't verify that they come from customers who have purchased the product.

Languages