to checkout total: €0.00

» Home page
» THERMAL INTERFACE MATERIALS
» Gap Fillers
» BERGQUIST GAP FILLER TGF 1000 50cc

226116767

elektronika@mcc.pl

3D PRINTING | AM(81)
HENKEL FOR ELECTRONICS(124)
Solder materials(37)
CHEMISTRY FOR INDUSTRY(343)
CHEMISTRY FOR AUTOMOTIVE(159)
THERMAL INTERFACE MATERIALS(53)
- Gap Fillers(10)
- Thermal conductive adhesives(14)
- Phase change materials(2)
- Sil, Poly & Q-Pad(1)
- Thermal Grease(3)
- Gap Pad(21)
- Film adhesives(1)
- Bond Ply(1)
ACCESSORIES(55)
ELECTRONICON FOIL CAPACITORS(0)
MECCAL HEATSINKS(0)
New products
Products on sale

Special offer

BERGQUIST GAP FILLER TGF 2000 50cc

€33.04

Regular price: ~~€35.89~~

Lowest price: €33.51

pc.

Lubricant - aluminum anti-seize spray LOCTITE LB 8151 400ML

€13.55

Regular price: ~~€15.21~~

Lowest price: €12.83

pc.

BERGQUIST GAP FILLER TGF 3600 50cc

€45.80

Regular price: ~~€49.60~~

Lowest price: €45.40

pc.

LOCTITE SF 7400, 20ml

€20.20

Regular price: ~~€22.01~~

Lowest price: €20.20

pc.

LOCTITE 407 BO20G PL

€20.56

Regular price: ~~€22.94~~

Lowest price: €19.85

pc.

LOCTITE 276 50ml

€46.29

Regular price: ~~€48.72~~

Lowest price: €43.85

pc.

Product of the Day

TEROSON MS 939 BLACK CR290ML

€13.43

pc.

LOCTITE 382 / SF 7455

€33.28

pc.

TEROSON MS 930 GREY CR310ML

€12.36

pc.

TEROSON MS 930 GREY FC570ML

€17.47

pc.

TEROSON PU 9225 250ml

€79.62

pc.

Forgot your password?

Create an account

BERGQUIST GAP FILLER TGF 1000 50cc

packshot-grp-bergquist-gap-filler-tgf-1000-112227-11-2019.png

Availability: 0

Dispatched within: 2 months

Delivery: The price does not include any possible payment costs check the delivery methods

Gross price: €28.70

incl. 23% TAX, excl. shipping costs

28.70

Net price: €23.33

excl. 23% TAX, excl. shipping costs

quantity pc.

product unavailable

add to wish list

Rating:

Vendor:

Product code: 2165958

Safety

Description

BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.

Thermal conductivity: 1 W/m-K
Room temperature as well as accelerated curing possible
Operating temperature from -60 to 175°C
UL94 V-0 compliance