Special offer
BERGQUIST GAP FILLER TGF 3600 400cc
BERGQUIST GAP FILLER TGF 3600 400cc

€334.84

Regular price: €357.30

Lowest price: €357.27

€272.22

Regular price: €290.48

Lowest price: €290.46
pc.
LOCTITE 460 20gr
LOCTITE 460 20gr

€21.13

Regular price: €23.13

Lowest price: €22.11

€17.18

Regular price: €18.80

Lowest price: €17.97
pc.
LOCTITE 3D IND 403 HDT80 1kg Black
LOCTITE 3D IND 403 HDT80 1kg Black

€281.53

Regular price: €312.06

Lowest price: €312.06

€228.89

Regular price: €253.71

Lowest price: €253.71
pc.
LOCTITE SF 7400, 20ml
LOCTITE SF 7400, 20ml

€19.96

Regular price: €21.75

Lowest price: €19.96

€16.23

Regular price: €17.68

Lowest price: €16.23
pc.
Product of the Day
TEROSON MS 939 BLACK CR290ML
TEROSON MS 939 BLACK CR290ML

€12.30

€10.00

pc.
LOCTITE 382 / SF 7455
LOCTITE 382 / SF 7455

€32.87

€26.73

pc.
TEROSON MS 930 GREY CR310ML
TEROSON MS 930 GREY CR310ML

€11.74

€9.54

pc.
TEROSON PU 9225 250ml
TEROSON PU 9225 250ml

€77.05

€62.64

pc.
Login

Solder paste LOCTITE GC 50 SAC305T5 84V 74K 30cc EFD

Availability: out of stock
Gross price: €85.24
incl. 23% TAX, excl. shipping costs
85.24
Net price: €69.30
excl. 23% TAX, excl. shipping costs
quantity pc.

product unavailable

add to wish list

Description

GC 50 solder paste is a halogen free, no-clean, Pb-free solder paste specially specially designed to provide enhanced stability when used in jetting and other dispensing applications. Please refer to the TDS for options and configurations.

  • Provides added long-term stability over a wide range of temperature conditions. Cpk >2.0 achievable with less than 50% tolerance
  • Optimized rheology suitable for solder paste jetting technology with process stability up to 28°C (82°F)
  • Good resistance to graping in demanding reflow profiles
  • Post reflow residues readily removed with electronics industry solvents
Files to download:

Files to download

GC 50 solder paste is a halogen free, no-clean, Pb-free solder paste specially specially designed to provide enhanced stability when used in jetting and other dispensing applications. Please refer to the TDS for options and configurations.

  • Provides added long-term stability over a wide range of temperature conditions. Cpk >2.0 achievable with less than 50% tolerance
  • Optimized rheology suitable for solder paste jetting technology with process stability up to 28°C (82°F)
  • Good resistance to graping in demanding reflow profiles
  • Post reflow residues readily removed with electronics industry solvents
Files to download:

Product reviews (0)

All reviews (positive and negative) are displayed. We don't verify that they come from customers who have purchased the product.

up
Shop is in view mode
View full version of the site
Sklep internetowy Shoper.pl