Solder paste LOCTITE GC 10 SAC305T4 885V 52K
- Halogen-free flux: passes IC with pretreatment IPC-TM-650 EN14582
- Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev. B
- Reflow: enhanced soak process window 150-200ºC (temperature and time), enhanced process window with superior coalescence and wetting, minimal hot clump at 182ºC, superior coalescence and wetting on small components including 01005, very shiny solder joints, clear, colorless residues for easy post-reflow inspection, residues print testable after 4x reflows
- Printing: down to 0.3 mm pitch, up to 72 hours stencil life, up to 24 hours abandon time, suitable for high-speed printing up to 125 mms-1, improved paste-transfer efficiency
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