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Solder paste LOCTITE GC 18 SAC305T4 885V 52U

packshot-grp-gc-18-09-2022_multicore (2).jpg
Availability: out of stock
Gross price: €125.86
incl. 23% TAX, excl. shipping costs
125.86
Net price: €102.32
excl. 23% TAX, excl. shipping costs
quantity pc.

product unavailable

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Rating: 5
Vendor: HARIMA
Product code: 2472691

Description

LOCTITE GC 18 upholds the performance attributes required for demanding SMT environments, maintaining stability for one year when stored at 26.5°C and for one month at temperatures up to 40°C. Designed to improve transfer efficiency for fine-pitch components such as 01005s and 0.4mm CSPs, the material’s slump resistance at higher soak temperatures allows for thorough fluxing action on challenging surface finishes such as Cu OSP and ImSn. As a result, the material also reduces void occurrences on BGAs, chip resistor (CR), chip capacitor (CC), SOICs, QFPs, chip resistors and a full range of QFN packages. Sustainability is built in to LOCTITE GC 18 as it facilitates the elimination of costly nitrogen reflow processes, reduces rework, lowers processing costs and cuts PPM defects across all areas of the production line.
Files to download:

Files to download

LOCTITE GC 18 upholds the performance attributes required for demanding SMT environments, maintaining stability for one year when stored at 26.5°C and for one month at temperatures up to 40°C. Designed to improve transfer efficiency for fine-pitch components such as 01005s and 0.4mm CSPs, the material’s slump resistance at higher soak temperatures allows for thorough fluxing action on challenging surface finishes such as Cu OSP and ImSn. As a result, the material also reduces void occurrences on BGAs, chip resistor (CR), chip capacitor (CC), SOICs, QFPs, chip resistors and a full range of QFN packages. Sustainability is built in to LOCTITE GC 18 as it facilitates the elimination of costly nitrogen reflow processes, reduces rework, lowers processing costs and cuts PPM defects across all areas of the production line.
Files to download:

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