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LOCTITE ECCOBOND UF 3811 5cc - MOQ 40 pcs

Availability: on order

Dispatched within: 2 months

Delivery: The price does not include any possible payment costs check the delivery methods

Gross price: €19.09

incl. 23% TAX, excl. shipping costs

19.09

Net price: €15.52

excl. 23% TAX, excl. shipping costs

quantity pc.

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Product code: 2063673

Description

LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.

Room temperature flow capability
Low viscosity material flows at room temperature with no additional preheating required
High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
Cures quickly at moderate temperatures to minimize stress to other components

Files to download:

ECCOBOND UF 3811-EN (5).pdf

Files to download

Room temperature flow capability
Low viscosity material flows at room temperature with no additional preheating required
High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
Cures quickly at moderate temperatures to minimize stress to other components

Files to download:

ECCOBOND UF 3811-EN (5).pdf

Shipping costs The price does not include any possible payment costs

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