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LOCTITE ECCOBOND UF 3811 5cc - MOQ 40 pcs

Availability: on order
Dispatched within: 2 months
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €19.47
incl. 23% TAX, excl. shipping costs
19.47
Net price: €15.83
excl. 23% TAX, excl. shipping costs
quantity pc.

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Description

LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
  • Room temperature flow capability
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
  • Cures quickly at moderate temperatures to minimize stress to other components

Files to download

LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
  • Room temperature flow capability
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
  • Cures quickly at moderate temperatures to minimize stress to other components

Shipping costs The price does not include any possible payment costs

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