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LOCTITE ECCOBOND UF 3811 55cc - MOQ 10 pcs
Availability:
on order
Dispatched within:
2 months
Price:
incl. 23% TAX, excl. shipping costs
Net price:
€64.47
excl. 23% TAX, excl. shipping costs
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Vendor:
Product code:
1824593
Description
LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
- Room temperature flow capability
- Low viscosity material flows at room temperature with no additional preheating required
- High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
- Cures quickly at moderate temperatures to minimize stress to other components
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