Special offer
BERGQUIST GAP FILLER TGF 3600 400cc
BERGQUIST GAP FILLER TGF 3600 400cc

€334.84

Regular price: €357.30

Lowest price: €357.27

€272.22

Regular price: €290.48

Lowest price: €290.46
pc.
LOCTITE 460 20gr
LOCTITE 460 20gr

€21.13

Regular price: €23.13

Lowest price: €22.11

€17.18

Regular price: €18.80

Lowest price: €17.97
pc.
LOCTITE 3D IND 403 HDT80 1kg Black
LOCTITE 3D IND 403 HDT80 1kg Black

€281.53

Regular price: €312.06

Lowest price: €312.06

€228.89

Regular price: €253.71

Lowest price: €253.71
pc.
LOCTITE SF 7400, 20ml
LOCTITE SF 7400, 20ml

€19.96

Regular price: €21.75

Lowest price: €19.96

€16.23

Regular price: €17.68

Lowest price: €16.23
pc.
Product of the Day
TEROSON MS 939 BLACK CR290ML
TEROSON MS 939 BLACK CR290ML

€12.30

€10.00

pc.
LOCTITE 382 / SF 7455
LOCTITE 382 / SF 7455

€32.87

€26.73

pc.
TEROSON MS 930 GREY CR310ML
TEROSON MS 930 GREY CR310ML

€11.74

€9.54

pc.
TEROSON PU 9225 250ml
TEROSON PU 9225 250ml

€77.05

€62.64

pc.
Login

LOCTITE ECCOBOND UF 3811 55cc - MOQ 10 pcs

Availability: on order
Dispatched within: 2 months
Delivery: The price does not include any possible payment costs check the delivery methods
Gross price: €85.94
incl. 23% TAX, excl. shipping costs
85.94
Net price: €69.87
excl. 23% TAX, excl. shipping costs
quantity pc.

product unavailable

add to wish list

Description

LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
  • Room temperature flow capability
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
  • Cures quickly at moderate temperatures to minimize stress to other components

Files to download

LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
  • Room temperature flow capability
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
  • Cures quickly at moderate temperatures to minimize stress to other components

Shipping costs The price does not include any possible payment costs

Shipping country:

Product reviews (0)

All reviews (positive and negative) are displayed. We don't verify that they come from customers who have purchased the product.

up
Shop is in view mode
View full version of the site
Sklep internetowy Shoper.pl