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Chipbonder for dispensing LOCTITE 3609 10CC EFD
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5
Description
- Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
- Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
- One component - requires no mixing
- Can be used in lead free wave solder with both water-based and alcohol-based fluxes
Files to download:
Files to download
- Particularly suitable for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required
- Designed for bonding surface mounted devices to printed circuit boards prior to wave soldering
- One component - requires no mixing
- Can be used in lead free wave solder with both water-based and alcohol-based fluxes
Files to download:
Technical data
| 18-25*C | No |
| 2-8*C | Yes |
| 0*C | No |
| -20*C | No |
| -40*C | No |
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