BERGQUIST® LIQUI BOND TLB EA1800 is a two component, silicone-free, thermally conductive epoxy liquid adhesive. It can be cured at room temperature and exhibits excellent chemical and mechanical stability. The product creates a high bond strength which eliminates the need for fasteners and maintains structural bond even in severe environments. It is ideal for use in filling any surface irregularities between heat sources and heat sinks of similar coefficient of thermal expansion.
Thermal conductivity: 1.8 W/m-K
High bond strength, room temperature cure
UL94 V-0 compliance
The price does not include any possible payment costs
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